Stress in Thin Films


12 Sept.			09:00 - 10:30

FRESCOES ROOM

ADVANCED MATERIALS

MICROSCOPY & NANOCHARACTERIZATION
TT.V - Technical Multi-Track with Parallel SYMPOSIA
Stress in Thin Films
Co-organized with Roma Tre University, Sapienza University of Rome Chair: Marco SEBASTIANI, Roma Tre University
This session is the first part (of two) of the workshop on 'Exploring Stress and Strain in Thin Films and Semiconductor Materials' with the aim to provide a focused platform for researchers and professionals to discuss the latest developments and research results related to stress and strain in thin films and semiconductor materials. Co-organised by Roma Tre University and Sapienza University of Rome, the event is structured into two distinct sessions, each dedicated to a specific aspect of the topic. This first session will focus on stress in thin films, covering topics such as the origin and control of residual stress, advanced measurement techniques and the impact of stress on the reliability of micro-electro-mechanical systems (MEMS). The second session will focus on strain in semiconductor materials, discussing the effects of strain on material properties, recent advances in measurement and control techniques, and the challenges of managing strain for improved material performance. This split will allow for an in-depth exploration of both stress and strain, providing participants with a comprehensive understanding of the interrelationships and differences between these two critical areas of materials science. The workshop brings together leading experts in the field to share their insights and latest research, providing valuable opportunities for learning and collaboration.
The symposium is part of the WS.VIII
TT.V.C.1 WS.VIII.1.1	Rostislav DANIEL Montanuniversität Leoben, Austria Origins and control of residual stress in thin films
TT.V.C.2 WS.VIII.1.2	Edoardo ROSSI Roma Tre University High resolution measurement Techniques for Stress in Thin Films
TT.V.C.3 WS.VIII.1.3	Savvas ORFANIDIS National Technical University of Athens, Greece NanoMECommons: Harmonisation of EU-wide nanomechanics protocols and relevant data exchange procedures, across representative cases; standardisation, interoperability, data workflow
TT.V.C.4 WS.VIII.1.4	Matthieu LE BAILLIF Thales Researche and Technology, France Residual Stress and reliability in Micro-Electromechanical Systems (MEMS)
TT.V.C.5 WS.VIII.1.5	Saqib RASHID Roma Tre University In-situ measurement of residual stress in MEMS devices