IPCEIs solutions


12 Sept.			14:00 - 15:30

CLOISTER ROOM

SOCIAL IMPACT & ETHICS

CHIPS & MICRO-NANO ELECTRONICS
TT.VII - Technical Multi-Track with Parallel SYMPOSIA
IPCEIs solutions
Co-organized with AIRI, STMicroelectronics, Infineon Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics

The symposium is part of the WS.III
TT.VII.B.1 WS.III.1.1	Josef MOSER - CV Infineon Technologies, Austria Trapped ion quantum processor units (ionQPUs) for scalable quantum computers: developments and quality improvements
TT.VII.B.2 WS.III.1.2	André MUGLIETT STMicroelectronics, Malta Assembly, Test and Packaging is a critical step of the Semiconductors supply chain: Malta IPCEI supports re-shoring capacity and grow on innovative technology
TT.VII.B.3 WS.III.1.3	Sandra EGER - CV AT&S, Austria IC substrates & advanced packaging Technologies: key to the Computing systems of the Future
TT.VII.B.4 WS.III.1.4	Emanuele CORSI - CV MEMC-GlobalWafers The TeNeT Project: Leading Edge 300mm and 200mm Silicon Wafers Manufacturing in Italy to Strengthen the Europe’s Microelectronic Ecosystem

SAPIENZA UNIVERSITY OF ROME