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    updated on August 9, 2024

WS.III - IPCEIs Microelectronics

updated on September 5, 2024

 CLOISTER ROOM

WS.III

IPCEIs MICROELECTRONICS:
DEVICES AND SYSTEMS DRIVING THE DIGITAL AND GREEN TRANSITION

September 12

Co-organized with:
AIRI ST Bloc marque Qi V 1 ats logo RGB medium jpg logo desktop en IPCEI Logo klein 2 IPCEI

WORKSHOP COMMITTEE

Andrea PORCARI, AIRI
Cosimo MUSCA, STMicroelectronics

                     
Europe is increasingly investing to strengthen our capacity and leadership in the semiconductor value chain, from materials to design, manufacturing and packaging of advanced chips and electronics devices and systems. The 2023 EU Chips Act is leveraging R&I efforts of all EU players in the field, and the two IPCEI (Important Projects of Common Interest) ME and ME/CT (MicroElectronics and Communication Technology) are supporting the transformation. IPCEI ME/CT builds on the first IPCEI ME results and involves 68 projects from 56 companies and an ecosystem of over 600 R&I players. Breakthrough are expected along four lines: sensing, thinking, acting, communicating, toward more efficient, faster, secure and reliable devices . Italy and Austria are key players in all technology fields of IPCEI, such as novel semiconductor materials, sensors, actuators, high performance processors, and artificial intelligence systems. Solutions developed are strategic assets for major industrial value chains, including communications (5G, 6G), autonomous driving, digital technologies, energy generation, distribution and use. The workshop, following the events held in 2020 and 2022, will provide an opportunity for companies, R&I centres, and universities to learn on the achievements and ongoing activities of IPCEI, and network with key players of the field. The first part will include talks from authoritative IPCEI partners. The second part will be a matchmaking session with IPCEI representatives, open to large industries, SMEs, startups, research organizations willing to meet, share and discuss RtoB and BtoB opportunities with IPCEI representatives.
READ HERE the catalogue with the profile of the organizations and speakers participating to the matchmaking.
 
September 12
14:00 - 15:30
IPCEIs solutions
WS.III.1 - TT.VII.B
Co-organized with AIRI, STMicroelectronics, Infineon
Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics
WS.III.1.1
TT.VII.B.1
Josef MOSER - CV
Infineon Technologies, Austria
Trapped ion quantum processor units (ionQPUs) for scalable quantum computers: developments and quality improvements
!DONNA PPT eceded
WS.III.1.2
TT.VII.B.2
André MUGLIETT
STMicroelectronics, Malta
Assembly, Test and Packaging is a critical step of the Semiconductors supply chain: Malta IPCEI supports re-shoring capacity and grow on innovative technology
!NEUTRO PPT eceded
WS.III.1.3
TT.VII.B.3
Sandra EGER - CV
AT&S, Austria
IC substrates & advanced packaging Technologies: key to the Computing systems of the Future
!NEUTRO PPT eceded
WS.III.1.4
TT.VII.B.4
Emanuele CORSI - CV
MEMC-GlobalWafers
The TeNeT Project: Leading Edge 300mm and 200mm Silicon Wafers Manufacturing in Italy to Strengthen the Europe’s Microelectronic Ecosystem
!NEUTRO PPT eceded
 
16:00 - 17:30
IPCEIs solutions & matchmaking
WS.III.2 - TT.VIII.B
Co-organized with AIRI, STMicroelectronics & Infineon
Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics
Register to the matchmaking session to meet, share, and discuss research and business opportunities with IPCEI representatives.
PRE-REGISTER HERE
Info: www.airi.it
WS.III.2.1
TT.VIII.B.1
Lorenza FERRARIO - CVMicro Nano Facility
Vittorio GUARNIERI - CVFBK
MNF the Fondazione Bruno Kessler semiconductor Open Facility
FERRARIO Lorenza 2024 !NEUTRO PPT eceded
 WS.III.2.2
TT.VIII.B.2
Salvatore LOMBARDO - CV
CNR-IMM
The microtech for green project
!NEUTRO PPT eceded
WS.III.2.3
TT.VIII.B.3
Alessandro FONTE - CV
Siae Microelettronica
Enabling Microelectronics Solutions for Next-Generation High-Performance 6G Networks
!DONNA PPT eceded
WS.III.2.4
TT.VIII.B.4
Alfredo MAGLIONE - CV
Optoi
Photonic sensors and MEMS microsystems: the OPTOI microelectronic packaging facility
!DONNA PPT eceded
WS.III.2.5
TT.VIII.B.5
Marco DELUCA - CV
Silicon Austria Labs GmbH (SAL), Austria
Leading advanced thin film technologies for electronic-based microsystems
!UOMO PPT eceded
WS.III.2.6
TT.VIII.B.6
Elke KRAKER - CV
Material Center Leoben, GmbH (MCL), Austria
Materials understanding is the key to new innovations in microelectronics
!UOMO PPT eceded
 

 

 
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INFO & CONTACTS

Dr. Federica SCROFANI

Tel. +39 06 49766676
Mob. +39 339 7714107
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