updated on July 26, 2024
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WS.III IPCEIs MICROELECTRONICS: September 12 |
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WORKSHOP COMMITTEE |
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| Europe is increasingly investing to strengthen our capacity and leadership in the semiconductor value chain, from materials to design, manufacturing and packaging of advanced chips and electronics devices and systems. The 2023 EU Chips Act is leveraging R&I efforts of all EU players in the field, and the two IPCEI (Important Projects of Common Interest) ME and ME/CT (MicroElectronics and Communication Technology) are supporting the transformation. IPCEI ME/CT builds on the first IPCEI ME results and involves 68 projects from 56 companies and an ecosystem of over 600 R&I players. Breakthrough are expected along four lines: sensing, thinking, acting, communicating, toward more efficient, faster, secure and reliable devices . Italy and Austria are key players in all technology fields of IPCEI, such as novel semiconductor materials, sensors, actuators, high performance processors, and artificial intelligence systems. Solutions developed are strategic assets for major industrial value chains, including communications (5G, 6G), autonomous driving, digital technologies, energy generation, distribution and use. The workshop, following the events held in 2020 and 2022, will provide an opportunity for companies, R&I centres, and universities to learn on the achievements and ongoing activities of IPCEI, and network with key players of the field. The first part will include talks from authoritative IPCEI partners. The second part will be a matchmaking session with IPCEI representatives, open to large industries, SMEs, startups, research organizations willing to meet, share and discuss RtoB and BtoB opportunities with IPCEI representatives. | |||||||||||||
| September 12 | ||||||||
| 14:00 - 15:30 IPCEIs solutions WS.III.1 - TT.VII.B |
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| Co-organized with AIRI, STMicroelectronics, Infineon Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics |
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| WS.III.1.1 TT.VII.B.1 |
Josef MOSER Infineon, Austria Trapped ion quantum processor units (ionQPUs) for scalable quantum computers: developments and quality improvements |
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| WS.III.1.2 TT.VII.B.2 |
André MUGLIETT STMicroelectronics, Malta Assembly, Test and Packaging is a critical step of the Semiconductors supply chain: Malta IPCEI supports re-shoring capacity and grow on innovative technology |
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| WS.III.1.3 TT.VII.B.3 |
Sandra EGER AT&S, Austria IC substrates & advanced packaging Technologies: key to the Computing systems of the Future |
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| WS.III.1.4 TT.VII.B.4 |
Emanuele CORSI MEMC-GlobalWafers The TeNeT Project: Leading Edge 300mm and 200mm Silicon Wafers Manufacturing in Italy to Strengthen the Europe’s Microelectronic Ecosystem |
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| 16:00 - 17:30 IPCEIs solutions & matchmaking WS.III.2 - TT.VIII.B |
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| Co-organized with AIRI, STMicroelectronics & Infineon Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics |
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| Register to the matchmaking session to meet, share, and discuss research and business opportunities with IPCEI representatives. PRE-REGISTER HERE Info: www.airi.it |
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| WS.III.2.1 TT.VIII.B.1 |
Lorenza FERRARIO, Micro Nano Facility Vittorio GUARNIERI, FBK The FBK semiconductor Open Facility |
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| WS.III.2.2 TT.VIII.B.2 |
Salvatore LOMBARDO CNR-IMM & Microsystem National Research Council The microtech for green project |
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| WS.III.2.3 TT.VIII.B.3 |
Alessandro FONTE Siae Microelettronica Title to be defined |
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| WS.III.2.4 TT.VIII.B.4 |
Alfredo MAGLIONE Optoi Title to be defined |
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Back to Overview | Go to Plan 12 September |  |